光刻胶原材料|Photoresist raw material
光刻胶原材料
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环氧亚麻油
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拟茎点霉素A, 来源于Phomopsis leptostromiformis
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FOr-NLE-OH
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2,6-双(4-叠氮苯亚甲基)环己酮(加约30%水湿润,本品干重约为25g)[用于感光材料的研究]
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Cycloheptyl Formate
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(3α,5β,7α,12α)-Cholane-3,7,12,24-tetrol 3,7,12-Triformate
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For-Met-Ala-Oh
CAS号:15183-28-5
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For-Phe-OMe
CAS号:2311-21-9
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Fmoc-trp(for)-oh
CAS号:152338-45-9